Increasing implementation of SLC NAND flash memory in in-vehicle infotainment systems among automotive sectors is a major factor expected to drive growth of the global low density SLC NAND flash memory market in the forecast period, owing to advance innovative features offered such as Bluetooth connectivity, voice control, real-time traffic updates, and navigation information.
Moreover, rising adoption of NAND flash technologies in healthcare applications across the globe is expected to offer various implementation opportunities for low density SLC NAND flash memory which in turn is expected to proliferate global market growth.
The global low density SLC NAND flash memory market is estimated to value at around US$ 0.9 Bn in 2018, and is expected to register a CAGR of -1.9%. The first five-year cumulative revenue (2018–2022) is projected to be over US$ 4 Bn, which is expected to increase significantly over the latter part of the five-year forecast period.
The global low density SLC NAND flash memory market report has been segmented on the basis of component type, application, and region/country. On the basis of type, the global low density SLC NAND flash memory market is segmented into 8 GBits, 4 GBits, 2 GBits, and others. On the basis of application, the global low density SLC NAND flash memory market is segmented into solid state drives, mobile phone, flash memory cards, and others.
On the basis of region/country, the global low density SLC NAND flash memory market is segmented into North America, Europe, China, Japan, Southeast Asia, India, South America, Middle East & Africa, and Rest of the World. In 2017, the market in China is expected to dominate in the global low density SLC NAND flash memory market in terms of revenue, due to increasing use of low density SLC NAND flash memory to achieve high memory utilization and speed. The market in Europe is expected to account for over 15% in 2017 in the global low density SLC NAND flash memory market.
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Prominent players in the global market include SK hynix, Inc., Winbond Electronics Corporation, Toshiba Corporation, GigaDevice Semiconductor (Beijing) Inc., ATO Solution Co., Ltd., Macronix International Co., Ltd., Powerchip Technology Corporation, SMIC International Integrated Circuit Manufacturing Co., Ltd., Micron Technology, Inc., Cypress Semiconductor Corporation (Spansion Inc.), and Samsung Electronics Co. Ltd.
Table Of Content:
1.0 Chapter 1
- 1.1 Preface
- 1.2 Assumptions
- 1.3 Abbreviations
2.0 Chapter 2
- 2.1 Report Description
- 2.1.1 Market Definition and Scope
- 2.2 Executive Summary
- 2.2.1 Market Snapshot, By Type
- 2.2.3 Market Snapshot, By Application
- 2.2.4 Market Snapshot, By Region/Country
- 2.2.5 Prudour Opportunity Map Analysis
3.0 Chapter 3
- 3.0.1 Global Low Density SLC NAND Flash Memory Market Dynamics
- 3.0.2 Drivers (D)
- 3.0.3 Restraints (R)
- 3.0.4 Opportunities
- 3.0.5 Trends
- 3.0.6 DR Impact Analysis
- 3.0.7 PEST Analysis
- 3.0.8 PORTER’S Five Forces Analysis
- 3.0.9 Manufacturing Cost Analysis
4.0 Chapter 4
- 4.0.1 Global Low Density SLC NAND Flash Memory Market Analysis, by Type
- 4.0.2 Overview
- 4.0.3 Segment Trends
- 4.0.4 Market Value (US$ Mn) and Forecast, 2013–2027
- 4.1 8 GBits